The Majorana 2 quantum chip embodies Microsoft’s efforts to use a topological architecture to pursue fault-tolerant quantum computing.
Samsung, SK hynix, Sandisk, Kioxia and Micron report building out new DRAM and NAND flash manufacturing and packaging facilities coming on line in late 2027 or 2028.
Recent HDD head manufacturing announcements indicate that the industry will increase unit shipments in addition to overall storage capacity shipments by decade’s end.
Agentic assistants are changing knowledge work through a “Claude-ification” trend that is now coming to desktop agents for non-coders. But significant gaps remain.
AI models without strong business context risk costly errors, but vendor approaches to “context” vary. Enterprises must take ownership of their data’s definition layer.
Built to bring the productivity gains of Claude Cowork to non-coders, these AI assistants have lots of promise but require thoughtful deployment in enterprise settings.
The cloud-based agentic AI platform aims to help human researchers overcome resource constraints and complex data challenges to accelerate science at scale.
The SNIA MRAM SIG will explore, through its interface subgroup, an architectural ecosystem enabling MRAM connectivity via LPDDR, CXL and chiplet interfaces.
Despite C-suite optimism and more investment, there’s a big gap between AI aspirations and enterprise readiness. The answer? Savvy redesign of core processes and roles.
The First-Person Narrative about my IEEE experience is available through the IEEE history center at: https://ethw.org/First-Hand:Pursuit_of_Happiness#cite_note-39.