China is targeting 70% local wafer sourcing as firms like Eswin scale 12-inch production, aiming to reduce reliance on foreign suppliers and support growing AI chip demand.
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ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.
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Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.
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Are we nearing the tipping point for humanoid robots? We actually might, given that 1X just hit full-scale manufacturing of Neo.
TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.
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Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program’s decade-long history.
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TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.
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Bolt Graphics has announced its completed tape-out of a test chip for its Zeus GPU, marking the startup’s first move from FPGA emulation to manufactured silicon.
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Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab.
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TSMC strengthens its bifurcated process technology development approach with A14, A13, and N2U aimed at client applications and A16, A12, and N2X for high-performance data center designs.
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