Intel becomes the first company to ship high-volume logic chips made with ASML’s High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners
 Intel becomes the first company to ship high-volume logic chips made with ASML’s High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

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Intel’s EMIB packaging gains traction as chip designers look to skirt TSMC’s CoWoS constraints — Google’s reported decision for 9th-gen TPUs highlights Intel’s attractive alternative
 Intel’s EMIB packaging gains traction as chip designers look to skirt TSMC’s CoWoS constraints — Google’s reported decision for 9th-gen TPUs highlights Intel’s attractive alternative

Google has reportedly chosen Intel’s EMIB-T over TSMC’s CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

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Researchers create programmable material that can steer heat and remember its state without power — breakthrough could eventually aid AI chip cooling and silicon photonics
 Researchers create programmable material that can steer heat and remember its state without power — breakthrough could eventually aid AI chip cooling and silicon photonics

Researchers created a programmable thermal material that steers heat and retains its state without power, a breakthrough that could benefit AI chips, silicon photonics, and infrared devices.

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Micron commits $500 million to GlobalWafers’ Texas wafer plant as it raises U.S. spending to $250 billion — memory maker aims to manufacture 40% of DRAM in the US by 2035

Running until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron’s DRAM in the U.S. by the mid-2030s.

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Intel’s new space-grade Starfire chip is a Panther Lake SoC that puts an 18A CPU into orbit — chip designed for the US government leverages Intel 3 for the GPU

Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.

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Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing
 Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing

Apple’s planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia’s Blackwell accelerators.

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SK hynix raises a record $26.5 billion in historic U.S. IPO — South Korean memory giant to fund massive HBM manufacturing expansions

SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.

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Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

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Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs
 Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond conventional HBM limits by improving cooling, bandwidth, and capacity while reducing reliance on TSV-heavy vertical stacks.

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Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant
 Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant

Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.

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