IBM and Lam Research team up on High NA EUV dry resist to push chip scaling past 1nm

The two companies have worked together for more than a decade, with IBM unveiling what it described as the world’s first 2nm node chip in 2021 as part of the partnership.

How Lilly Used AI To Crank Up Production Of Its Popular GLP-1s

Forget the drug discovery hype. Here’s how the world’s largest pharma company is seeing a payoff from AI right now.

How Global Conflicts Are Reshaping The Startup Playbook

As the war in Iran begins to disrupt markets and capital flows, founders and small businesses must adapt and integrate smarter risk management.

China’s top chip execs claim ASML alternative ‘small, fragmented, and weak’ — Chinese industry titans call for national effort to invest in advanced chipmaking tools

China’s most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.

His house burned down. He used the insurance money to build PopSockets.

Does a consumer hardware company need to get on the VC treadmill to succeed? Eleven years and 290 million products sold across 115 countries later, PopSockets has proven that the bootstrapped, low-dilution p…

You Can Now Rent This Robot For $1,000 Per Day

Want a robot? You can now get a humanoid robot from Agibot delivered, set up, and running for the low, low price of $1,000 a day …

ISSCC 2026: Rebellions details industry’s first quad-chiplet AI solution with UCIe interconnects — claims Rebel100 AI accelerator equals the power of Nvidia H200 with lower power envelope

Rebellions details how it developed one of the world’s first quad-chiplet AI accelerator with UCIe interconnects and how it did not use all of the technologies that the UCIe 1.0 specifications includes.

ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count — ‘We are actually matching the performance of the more expensive and complex GB200’

Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,