Decoupling from China would cost the West $23.6tn
Decoupling from China would cost the West $23.6tn

Cutting the West’s reliance on China would carry a staggering price. A new study puts the cost of decoupling from China at $23.6tn over 25 years, and warns the bill would land hardest on the industries building Europe’s tech future. The West has spent …

The AI boom broke the memory market, and the bust could be brutal
The AI boom broke the memory market, and the bust could be brutal

The AI boom has broken the memory market’s oldest rule. Prices that should be falling are soaring instead, and the AI memory crunch will not ease until 2028. The hangover, when it comes, could be brutal. Memory is meant to be boring. For decades DRAM a…

Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing
Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing

Apple’s planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia’s Blackwell accelerators.

SK Hynix raises $26.5B in the biggest foreign IPO in US history, is urged to build new US fabs

The AI chip boom just produced its biggest Wall Street moment yet. Now SK Hynix and Samsung are being asked to build U.S. factories.

SK hynix raises a record $26.5 billion in historic U.S. IPO — South Korean memory giant to fund massive HBM manufacturing expansions

SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.

Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs
Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond conventional HBM limits by improving cooling, bandwidth, and capacity while reducing reliance on TSV-heavy vertical stacks.

Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant
Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant

Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.

A €91M bet on the diamond microscope that could be Europe’s next ASML
A €91M bet on the diamond microscope that could be Europe’s next ASML

Europe uses about a fifth of the world’s chips, but makes only a tenth of them. A three-year-old Munich startup thinks it can help close that gap, and Brussels has just backed the bet. QuantumDiamonds is a spin-out of the Technical University of Munich…